TSPF is the thermal interface material that combines advantage with low thermal resistance, electrical isolation, and thermal settable properties.  Based on the epoxy resin and specific ceramic filler, this product can be used as adhesive material for the interface assembly especially for electric component manufacturing, such as LED bulb, PCB, Heat sink and etc. Comparing with traditional thermal interface material, TSP provides more design freedoms particularly in the thin shape structure, high reliability, and high thermal conductivity applications.

  • Excellent Thermal Conductivity
  • Easy Process
  • Thermal Curing at elevated temperature
  • Customized structure available

  • Applications
  • Electronic device
  • Automotive
  • High brightness LED module

  • Product Series

    TSP brochure