(1)Thermal Conductive Ink
  Material
 
  • Polymer
    		•
     
  • Ceramic filler
    		•
    Features
     
  • Low thermal resistivity to reduce     the temperature of devices
    		•
     
  • Screen printing available
    		•
    Application
     
  • Passive devices with high power
    		•
       
     
    (2)Interposer
      Material
     
  • Polymer
    		•
     
  • Ceramic filler
    		•
    Features
     
  • Electric conductive with EMI     shielding advantage
    •  
  • Good adhesive with metal under
        hot press process
  • RoHS compliance
    		•
    Application
     
  • EMI shielding
    		•
  • MEMS Microphone

    		•  
       
      POLYTRONICS TECHNOLOGY CORPORATION
    300 新竹市科學園區工業東四路24-1號
    TEL: +886-3-5643931          FAX: +886-3-5644624    		 UL CSA TUV Certified